Layers | 1-2 Qat |
Qelindiya qedandî | 16-134mil (0,4mm-3,4mm) |
Max. Ebat | 500mm * 1200mm |
Qûrahiya sifir | 35um, 70um, 1 heta 10oZ |
Min Line Width / Cihê | 4mil (0.1mm) |
Min Mezinahiya Holê Qediyayî | 0.95mm |
Min. Mezinahiya Drill | 1.00mm |
Max. Mezinahiya Drill | 6.5mm |
Toleransê Mezinahiya Holê qedandî | ± 0.050mm |
Aperture Position Precision | ± 0.076mm |
Min SMT PAD Size | 0.4mm±0.1mm |
Min.Solder Mask PAD | 0.05mm (2mil) |
Min.Solder Mask Cover | 0.05mm (2mil) |
Maskeya Solder Qelindiya | > 12 m |
Biqedandina Rûyê | HAL, HAL Bêserûber, OSP, Zêrîn Immersion, hwd |
HAL Thickness | 5-12 m |
Qelindahiya Zêrîn Immersion | 1-3 mil |
Qelindahiya Fîlm OSP | ENTEK PLUS HT:0.3-0.5um; F2: 0,15-0,3um |
Dawîkirina Outline | Routing & Punching; Veguhastina Rastiyê ± 0.10mm |
Têkiliya Termal | 1.0 ber 12w/mk |
FOB Port | Shenzhen |
Export Carton Dimensions L / W / H | 36 x 26 x 25 Santîmetre |
Dema pêkhatinê | 3-7 rojan |
Yekîneyên per Kartonê Export | 5.0 |
Export Carton Weight | 18 Kîlo |